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10M02SCU169C8G
Intel ( Altera )
Product No:
10M02SCU169C8G
Manufacturer:
Package:
169-UBGA (11x11)
Batch:
-
Datasheet:
Description:
IC FPGA 130 I/O 169UBGA
Delivery:
Payment:
In Stock : Please Inquiry
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10M02SCU169C8G - Product Information
| Mfr | Intel |
| Series | MAX® 10 |
| Package | Tray |
| Mounting Type | Surface Mount |
| Number of I/O | 130 |
| Package / Case | 169-LFBGA |
| Product Status | Active |
| Total RAM Bits | 110592 |
| Voltage - Supply | 2.85V ~ 3.465V |
| Number of LABs/CLBs | 125 |
| DigiKey Programmable | Not Verified |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Supplier Device Package | 169-UBGA (11x11) |
| Number of Logic Elements/Cells | 2000 |
10M02SCU169C8G Altera Description
Intel® MAX® 10 devices are single-chip, non-volatile low-cost programmable logic devices (PLDs) to integrate the optimal set of system components.
The highlights of the Intel MAX 10 devices include:
• Internally stored dual configuration flash
• User flash memory
• Instant on support
• Integrated analog-to-digital converters (ADCs)
• Single-chip Nios II soft core processor support
Intel MAX 10 devices are the ideal solution for system management, I/O expansion, communication control planes, industrial, automotive, and consumer applications.
10M02SCU169C8G Altera Key Advantages
| Advantage | Supporting Feature |
| Simple and fast configuration | Secure on-die flash memory enables device configuration in less than 10 ms |
| Flexibility and integration | • Single device integrating PLD logic, RAM, flash memory, digital signal processing (DSP), ADC, phase-locked loop (PLL), and I/Os • Small packages available from 3 mm × 3 mm |
| Low power | • Sleep mode—significant standby power reduction and resumption in less than 1 ms • Longer battery life—resumption from full power-off in less than 10 ms |
| 20-year-estimated life cycle | Built on TSMC's 55 nm embedded flash process technology |
| High productivity design tools | • Intel Quartus® Prime Lite edition (no cost license) • Platform Designer (Standard) system integration tool • DSP Builder for Intel FPGAs • Nios® II Embedded Design Suite (EDS) |
10M02SCU169C8G Altera Intel MAX 10 Device Features
| Feature | Description |
| Technology | 55 nm TSMC Embedded Flash (Flash + SRAM) process technology |
| Packaging | • Low cost, small form factor packages—support multiple packaging technologies and pin pitches • Multiple device densities with compatible package footprints for seamless migration between different device densities • RoHS6-compliant |
| Core architecture | • 4-input look-up table (LUT) and single register logic element (LE) • LEs arranged in logic array block (LAB) • Embedded RAM and user flash memory • Clocks and PLLs • Embedded multiplier blocks • General purpose I/Os |
| Internal memory blocks | • M9K—9 kilobits (Kb) memory blocks • Cascadable blocks to create RAM, dual port, and FIFO functions |
| User flash memory (UFM) | • User accessible non-volatile storage • High speed operating frequency • Large memory size • High data retention • Multiple interface option |
| Embedded multiplier blocks | • One 18 × 18 or two 9 × 9 multiplier modes • Cascadable blocks enabling creation of filters, arithmetic functions, and image processing pipelines |
| ADC | • 12-bit successive approximation register (SAR) type • Up to 17 analog inputs • Cumulative speed up to 1 million samples per second ( MSPS) • Integrated temperature sensing capability |
| Clock networks | • Global clocks support • High speed frequency in clock network |
| Internal oscillator | Built-in internal ring oscillator |
| PLLs | • Analog-based • Low jitter • High precision clock synthesis • Clock delay compensation • Zero delay buffering • Multiple output taps |
| General-purpose I/Os (GPIOs) | • Multiple I/O standards support • On-chip termination (OCT) • Up to 830 megabits per second (Mbps) LVDS receiver, 800 Mbps LVDS transmitter |
| External memory interface (EMIF) (1) | Supports up to 600 Mbps external memory interfaces: • DDR3, DDR3L, DDR2, LPDDR2 (on 10M16, 10M25, 10M40, and 10M50.) • SRAM (Hardware support only) Note: For 600 Mbps performance, –6 device speed grade is required. Performance varies according to device grade (commercial, industrial, or automotive) and device speed grade (–6 or –7). Refer to the Intel MAX 10 FPGA Device Datasheet or External Memory Interface Spec Estimator for more details. |
| Configuration | • Internal configuration • JTAG • Advanced Encryption Standard (AES) 128-bit encryption and compression options • Flash memory data retention of 20 years at 85 °C |
| Flexible power supply schemes | • Single- and dual-supply device options • Dynamically controlled input buffer power down • Sleep mode for dynamic power reduction |
10M02SCU169C8G Altera Ordering Information
10M02SCU169C8G Altera Reference Links
Intel® MAX® 10 FPGA Device Datasheet
Altera® FPGAs and Programmable Solutions Products
Altera® FPGAs and Programmable Solutions Applications
Altera® FPGAs and Programmable Solutions Technology
Altera® FPGAs and Programmable Solutions Support
MAX10 Motor Control using a Single-Chip Low-Cost Non-Volatile FPGA
2000+Daily average RFQ Volume
30,000,000Standard Product Unit
2800+Worldwide Manufacturers
15,000 ㎡In-stock Warehouse
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