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ACA-SPI-004-K01

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ACA-SPI-004-K01

LOTES

Product No:

ACA-SPI-004-K01

Manufacturer:

LOTES

Package:

-

Batch:

-

Datasheet:

-

Description:

SPI 8 PIN_IC 208mil

Delivery:

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Payment:

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ACA-SPI-004-K01 - Product Information

Specification
FAQ
Datasheet
Mfr LOTES
Type SOIC
Series -
Package Tape & Reel (TR)
Features Board Guide, Closed Frame
Termination Solder
Pitch - Post 0.050" (1.27mm)
Mounting Type Surface Mount
Pitch - Mating 0.050" (1.27mm)
Product Status Active
Housing Material Liquid Crystal Polymer (LCP)
Contact Resistance 30mOhm
Contact Finish - Post Gold
Operating Temperature -
Contact Finish - Mating Gold
Contact Material - Post Phosphor Bronze
Termination Post Length -
Contact Material - Mating Phosphor Bronze
Material Flammability Rating UL94 V-0
Contact Finish Thickness - Post 1.00µin (0.025µm)
Contact Finish Thickness - Mating 1.00µin (0.025µm)
Number of Positions or Pins (Grid) 8 (2 x 4)

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