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BDN09-3CB

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BDN09-3CB

CTS Thermal Management Products

Product No:

BDN09-3CB

Package:

-

Batch:

-

Datasheet:

-

Description:

HEATSINK CPU .91" SQ

Delivery:

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Payment:

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In Stock : 990

Minimum: 1 Multiples: 1

Qty

Unit Price

  • 1

    1.311

  • 10

    1.2483

  • 25

    1.21562

  • 50

    1.18275

  • 100

    1.11701

  • 250

    1.051308

  • 500

    0.985606

  • 1000

    0.919904

  • 5000

    0.887053

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BDN09-3CB - Product Information

Specification
FAQ
Datasheet
Mfr CTS Thermal Management Products
Type Top Mount
Shape Square, Pin Fins
Width 0.910" (23.11mm)
Length 0.910" (23.11mm)
Series BDN
Package Box
Diameter -
Material Aluminum
Fin Height 0.355" (9.02mm)
Package Cooled Assorted (BGA, LGA, CPU, ASIC...)
Product Status Active
Material Finish Black Anodized
Attachment Method Thermal Tape, Adhesive (Not Included)
Base Product Number BDN09
Thermal Resistance @ Natural 26.90°C/W
Power Dissipation @ Temperature Rise -
Thermal Resistance @ Forced Air Flow 9.60°C/W @ 400 LFM

It is empty.