The best one stop electronic component platform.
Home / Heat Sinks / HSB24-252510
HSB24-252510

Picture is only for your reference.

HSB24-252510

CUI Devices

Product No:

HSB24-252510

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Datasheet:

pdf

Description:

HEAT SINK, BGA,25 X 25 X 10 MM

Delivery:

1.webp 4.webp 5.webp 2.webp 3.webp

Payment:

paypal.webp paypal02.webp paypal03.webp paypal04.webp

 

In Stock : 737

Minimum: 1 Multiples: 1

Qty

Unit Price

  • 1

    0.7695

  • 10

    0.7467

  • 25

    0.72542

  • 50

    0.68229

  • 100

    0.61313

  • 250

    0.604504

  • 500

    0.56563

  • 1000

    0.556985

Not the price you want? Send RFQ Now and we'll contact you ASAP.

Certif02 Certif07 Certif03 Certif04 Certif08 Certif10 Certif09 Certif05 Certif06

HSB24-252510 - Product Information

Specification
FAQ
Datasheet
Mfr CUI Devices
Type Top Mount
Shape Square, Pin Fins
Width 0.984" (25.00mm)
Length 0.984" (25.00mm)
Series HSB
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 0.394" (10.00mm)
Package Cooled BGA
Product Status Active
Material Finish Black Anodized
Attachment Method Adhesive
Thermal Resistance @ Natural 18.10°C/W
Power Dissipation @ Temperature Rise 4.14W @ 75°C
Thermal Resistance @ Forced Air Flow 6.50°C/W @ 200 LFM