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HSS07-C20-P274

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HSS07-C20-P274

CUI Devices

Product No:

HSS07-C20-P274

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Datasheet:

pdf

Description:

HEAT SINK, STAMPING, TO-220, 21.

Delivery:

1.webp 4.webp 5.webp 2.webp 3.webp

Payment:

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In Stock : 1663

Minimum: 1 Multiples: 1

Qty

Unit Price

  • 1

    1.273

  • 10

    1.2103

  • 25

    1.17876

  • 50

    1.14684

  • 100

    1.083095

  • 250

    1.019388

  • 500

    0.955662

  • 1000

    0.891955

  • 5000

    0.860092

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HSS07-C20-P274 - Product Information

Specification
FAQ
Datasheet
Mfr CUI Devices
Type Board Level, Vertical
Shape Rectangular
Width 0.520" (13.21mm)
Length 0.853" (21.66mm)
Series HSS
Package Box
Diameter -
Material Copper Alloy
Fin Height 0.515" (13.08mm)
Package Cooled TO-220
Product Status Active
Material Finish Tin
Attachment Method PC Pin
Thermal Resistance @ Natural 29.57°C/W
Power Dissipation @ Temperature Rise 2.5W @ 75°C
Thermal Resistance @ Forced Air Flow 12.60°C/W @ 200 LFM