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PA0171

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PA0171

Chip Quik Inc.

Product No:

PA0171

Manufacturer:

Chip Quik Inc.

Package:

-

Batch:

-

Datasheet:

pdf

Description:

MINI SOIC-10 EXP PAD TO DIP-10 S

Delivery:

1.webp 4.webp 5.webp 2.webp 3.webp

Payment:

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In Stock : Please Inquiry

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PA0171 - Product Information

Specification
FAQ
Datasheet
Mfr Chip Quik Inc.
Pitch 0.020" (0.50mm)
Series Proto-Advantage
Package Bulk
Material FR4 Epoxy Glass
Product Status Active
Board Thickness 0.062" (1.57mm) 1/16"
Package Accepted MiniSOIC EP
Proto Board Type SMD to DIP
Size / Dimension 0.700" x 0.500" (17.78mm x 12.70mm)
Number of Positions 10